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VIA wafer depth measurement

Date:2020-06-04 Source:Samsun Technology

VIA wafer depth measurement using white light spectral interferometric sensors

VIA wafer depth measurement_heydanbo.com
Wafer depth measurement 3D profile



VIA wafer depth measurement_heydanbo.com
Depth measurement 2D topography

 


VIA wafer depth measurement_heydanbo.com
Depth = 112.3 +/-0.4 μm


 

VIA wafer depth measurement_heydanbo.com
Depth = 65.28 +/- 0.1 μm

 

VIA wafer depth measurement_heydanbo.com

Depth = 87.28 +/- 0.6 μm


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